显示 81 - 90 条结果，共 232 条结果。
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Ormet® TLPS, DAP-481-1
Ormet® DAP-481-1 paste is an excellent alternative to solders or silver filled adhesives for electronic packaging applications requiring very high electrical and thermal conductivity.
Die and substrate assemblyMetal electrodeChinaEuropeJapanKoreaTaiwanElectronicIndustrialSensors (MEMS, Optoelectronics)Ormet® -
TEPo
Triethylphosphate (TEPO) is a liquid phosphorus source used in depositing PSG and BPSG films for semiconductor applications.
DepositionDopingPhosphorus DopantsChinaEuropeJapanKoreaTaiwanLogicSemiconductors -
DYNALOY® 1931 Silver-Filled Conductive Epoxy
DYNALOY® 1931 Epoxy Silver Solder is a two component, pure silver epoxy adhesive system.
Polymer Removal ChemistriesChinaEuropeJapanKoreaTaiwanConductive AdhesivesDynaloy -
DYNALOY® 336 Low-cost Epoxy Silver Solder
DYNALOY® 336 Low-cost Epoxy Silver Solder is a two component, room temperature cure, silver-filled epoxy alloy that has the strong adhesive properties of the epoxies plus excellent electrical conductivity.
Components assemblyDie and substrate assemblyPolymer Removal ChemistriesChinaEuropeJapanKoreaTaiwanConductive AdhesivesDynaloy -
ACT® AS-65
ACT® AS-65 etch residue remover and positive photoresist stripper is a highly effective non hydroxylamine (HA) stripper used for photoresist stripping and residue removal in aluminum applications.
AI IC CleansChinaEuropeJapanKoreaTaiwanSemiconductorsACT® -
Particle-free Ag-ink, ACM-904
ACM-904 is a silver metal complex paste.
Board level EMI sheildingConformal EMI sheilidingMetal electrodeChinaEuropeJapanKoreaTaiwanElectronicIndustrialSemiconductorsOrmet® -
ACT® NE-200
ACT® NE-200 etch residue remover is a fluoride containing product especially formulated for removal of inorganic and highly oxidized etch residues and/or for controlled etching of contaminated oxide surfaces.
AI IC CleansChinaEuropeJapanKoreaTaiwanSemiconductorsACT® -
Ormet® TLPS, XCAP-823-1
Ormet® XCAP-823-1 is a Pb-free, Transient Liquid Phase Sintering (TLPS) paste formulated for system-in-package (SiP) assembly and specifically designed for use in applications with a wide variety of components.
Components assemblyDie and substrate assemblyChinaEuropeJapanKoreaTaiwanElectronicIndustrialSensors (MEMS, Optoelectronics)Ormet® -
DYNALOY® 335 Silver Epoxy Adhesive
DYNALOY® 335 Silver Epoxy Adhesive is a two component pure silver filled epoxy, which combines the excellent adhesive properties of epoxy with the electrical conductivity of pure silver.
Polymer Removal ChemistriesChinaEuropeJapanKoreaTaiwanConductive AdhesivesDynaloy -
DYNALOY® 325 Series Silver Epoxy Adhesive
The DYNALOY® 325 Series Silver Epoxy Adhesive consists of two different products varying primarily in viscosity: DYNALOY® 325 and 325-2.
Components assemblyDie and substrate assemblyPolymer Removal ChemistriesChinaEuropeJapanKoreaTaiwanConductive AdhesivesDynaloy