产品目录

本目录包含我们的半导体解决方案产品组合，包括半导体材料和交付系统与服务。有关详细信息，请查看每个产品页面上的数据表或联系我们当地的客户服务代表。还要注意，这是我们的全球产品组合。请筛选您的位置以查看所在国家/地区的可用产品。

  1. Copper Bulk CMP slurries: Cu Low dishing CMP, Cu High Rate CMP

    Our Copper Bulk CMP products are tunable Slurries designed to meet performance requirements for removal rate, topography and defectivity.

    Advanced Packaging
    BEOL Interconnect
    China
    Europe
    Japan
    Korea
    Taiwan
    Logic
    Sensors (MEMS, Optoelectronics)
    COPPEREADY®
    Copper
  2. Post CMP Cleans

    Our post CMP Clean products are formulated clean chemistry product normally used in brush box unit after CMP polishing step.

    Advanced Packaging
    BEOL Interconnect
    MOL MG & Contacts
    China
    Europe
    Japan
    Korea
    Taiwan
    Logic
    Sensors (MEMS, Optoelectronics)
    COPPEREADY®
  3. Copper Barrier CMP slurries: BAR Tunable barrier CMP

    Our Copper Barrier CMP products are tunable Slurries designed to meet performance requirements for removal rate with Copper, Liners and dielectric e.g. Low K rate tunability.

    Advanced Packaging
    BEOL Interconnect
    China
    Europe
    Japan
    Korea
    Taiwan
    Logic
    Sensors (MEMS, Optoelectronics)
    DA Nano®

寻找适合的材料

要找到适合的产品，工作量可能会很大。我们的专家可以帮助您找到最适合您需求的解决方案。

联系我们