Our wafer polishing slurries are designed by using colloidal silica abrasive and chemical additive formulation technology.
- Silicon Polishing
- China
- Europe
- Japan
- Korea
- Taiwan
- Logic
- Sensors (MEMS, Optoelectronics)
Our wafer polishing slurries are designed by using colloidal silica abrasive and chemical additive formulation technology.
Our wafer polishing slurries are designed by using colloidal silica abrasive and chemical additive formulation technology. This product family has proven HVM quality consistency, low metals contamination and excellent cost of ownership. Main applications include both stock and intermediate polishing for a wide range of wafer sizes including 200mm and 300mm.
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