BPS-729B surfactant formulated dicing solution.
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BPS-729B surfactant formulated dicing solution.
BPS-729B surfactant formulated dicing solution is used as an additive to DIW during the dicing process for high performance adherence of silicon particles and swarf (saw residue) on Al and Cu substrates, this product can also remove oxidation from bond pads. Because of the very low etch rate on various base materials, these substrates are not affected.
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