Ormet® DAP-481-1 paste is an excellent alternative to solders or silver filled adhesives for electronic packaging applications requiring very high electrical and thermal conductivity.
Category:
- Die and substrate assembly
- Metal electrode
Locations:
- China
- Europe
- Japan
- Korea
- Taiwan
Industry:
- Electronic
- Industrial
- Sensors (MEMS, Optoelectronics)
Brands:
- Ormet®