BPS-106

BPS-106 oxidation and organics remover for IC assembly and packaging is a formulated semiaqueous product optimized for cleaning of Aluminum surfaces to enhance wirebond related process and device reliability. A superior alternative to Ar/O2 plasma, this product reduces contamination from oxide, organics, solder flux and halogen residuals such as chlorine on bond pads. Specially tuned for cleaning of and compatibility with die attached lead frames, BGAs and tapes, BPS 106 oxidation and organics remover can also be extended to wafer cleans.