Tungsten CMP slurries

Our Tungsten CMP products are tunable Slurries designed to meet performance requirements for removal rate, topography and defectivity. This product family offers a wide variety of solutions, including highly selective, low selective and buff Tungsten slurries. They are designed by utilizing our advanced abrasive and chemical additive formulation technology. Key performance differentiations consist of optimal removal rates, wide selectivity windows and tunable dilution at point of use, all optimized for cost of ownership advantage.