显示 1 - 10 条结果，共 232 条结果。
- ACT® 410
ACT® 410 positive photoresist stripper is specially formulated for stripping hard to remove positive photoresist.
ACT®Al IC CleansUSKoreaChinaTaiwanJapanEuropeSemiconductors - CCl4 ─ Carbon tetrachloride
Carbon tetrachloride (CCl4) is mainly used as a Carbon source for the p-type doping of various III-V alloys.
DepositionDopingOther DopantsUSKoreaChinaTaiwanJapanEuropeSemiconductorsLogicMemory (DRAM, NAND, 3D NAND) - CHEMGUARD® GENIII CG050 High Flow Bubbler
CHEMGUARD® CG050 High Flow Bubbler is an automated high flow bubbler designed to support EPI manufacturing with for maximum uptime and to meet the demanding needs of todays manufacturing fabs.
CHEMGUARD®Chemical Delivery SystemsUSKoreaChinaTaiwanJapanEuropeBoronTitaniumCopperGalliumGermaniumHafniumTantalumTungstenLogicMemory (DRAM, NAND, 3D NAND)Sensors (MEMS, Optoelectronics)Advanced PackagingEquipmentDisplayIndustrialElectronic - ACT® 915A
ACT® 915A etch residue remover is a highly effective hydroxylamine (HA) based product for aluminum clean applications. It is well adopted in the worldwide semiconductor industry.
ACT®Al IC CleansUSKoreaChinaTaiwanJapanEuropeSemiconductors - Poly-Flush® Stereolithography (SLA) 3D Printing Cleaning Solvent
Poly-Flush® Stereolithography (SLA) 3D Printing Cleaning Solvent is a formulated solvent used to clean uncured resin from SLA 3D printed parts.
PolyFlushPolymer Removal ChemistriesUSKoreaChinaTaiwanJapanIndustrial - TMB
Trimethylborate (TMB) is used as a liquid boron dopant in the Thin Film Deposition of Borosilicate (BSG) and Borophosphosilicate (BPSG) glasses to reduce the reflow temperatures of the deposited glass.
DepositionDopingBoron DopantsMetalsUSKoreaChinaTaiwanJapanEuropeSemiconductorsLogicMemory (DRAM, NAND, 3D NAND) - Diethoxymethylsilane
Diethoxymethylsilane (DEMS®) Precursor is used as a silicon source for the chemical vapor deposition of high quality low constant films and silicon dioxide films.
Low-k DielectricsUSKoreaChinaTaiwanJapanEuropeSemiconductorsLogicMemory (DRAM, NAND, 3D NAND) - Dynasolve® Pi4310 Polyimide Remover
Dynasolve® Pi4310 Polyimide Remover is a uniquely formulated chemistry designed specifically for the removal of polyimide in various process stages requiring rework in wafer level packaging (WLP) applications.
Dynasolve®Litho CleansUSKoreaChinaTaiwanJapanEuropeAdvanced Packaging - QMAC® Quality Monitoring and Control Analytical System
Our QMAC® Quality Monitoring and Control Analytical System is a proven solution to enable successful semiconductor manufacturing by monitoring bulk and specialty gases impurities.
GASGUARDEquipment MonitoringUSKoreaChinaTaiwanJapanEuropeLogicMemory (DRAM, NAND, 3D NAND)Sensors (MEMS, Optoelectronics)Advanced PackagingEquipmentDisplayIndustrialElectronicSpray Foam InsulationConductive Adhesives - SiHCl3 ─ Trichlorosilane
Used mostly for silicon epi applications in semi fab and semi wafer production. Used with HCl for depositing Epitaxial film on wafers.
DepositionUSKoreaChinaTaiwanJapanEuropeHydrogenSiliconChlorineSemiconductors