Copper Bulk CMP slurries: Cu Low dishing CMP, Cu High Rate CMP

Our Copper Bulk CMP products are tunable Slurries designed to meet performance requirements for removal rate, topography and defectivity. This product family offers a wide variety of solutions for BEOL metal Interconnect and advanced packaging applications. They are designed by utilizing our advanced colloidal silica abrasive and chemical additive formulation technology. Key performance differentiations include high removal rates, low dishing and highly tunable dilution at point of use, all optimized for cost of ownership advantage, together with proven HVM quality consistency serving leading customers.