Post CMP Cleans

Our post CMP Clean products are formulated clean chemistry product normally used in brush box unit after CMP polishing step. It is used to provide superior cleaning on wafer surface while protecting the underlying thin films and materials. Designed by using chemical additive formulation technology, our pCMP clean product family enables enhanced reliability and yield through corrosion control and defects reduction by removing organic particle and metallic residues. With high dilution at point of use, our product is optimized for cost of ownership advantage.