Copper Barrier CMP slurries: BAR Tunable barrier CMP

Our Copper Barrier CMP products are tunable Slurries designed to meet performance requirements for removal rate with Copper, Liners and dielectric e.g. Low K rate tunability. This product family offers a wide variety of solutions for BEOL metal Interconnect and advanced packaging applications. They are designed by utilizing high purity colloidal silica abrasive and chemical additive formulation technology. Key performance differentiations include high removal rates (per % particle), optimized Cu(Co)/Oxide selectivity and high tunable dilution at point of use, all optimized for cost of ownership advantage, together with proven HVM quality consistency serving leading customers.